Foundry Services

Our E-Beam Evaporation process provides excellent film thickness control and can deposit up to six different materials in-situ. E-Beam Evaporation is often used when precious metals deposition is required and is an excellent choice for wafers that require lift-off processing.

In order to ensure the best results for metal lift-off, the underlying wafer and photoresist must be kept cool during metal deposition. This can be difficult to achieve while depositing thick layers. Rogue Valley Microdevices has developed a specialized low temperature E-Beam evaporation process specifically for use during metal lift-off processing.

The surface preparation of patterned silicon and quartz wafers intended for lift-off metal is also extremely important. We include Photoresist Bake and O2 Descum steps just prior to deposition to improve film adhesion.

Films available for deposition

We offer a wide variety of E-Beam Evaporation precious and non-precious metals. Non-precious metals and dielectric materials are available for Sputtering.

Metals available for E-Beam Evaporation include: