Phone: 541-774-1900

Sputtered Metals

We understand how important quality is to you. Our Sputter process has been designed to deposit ultra-clean metal and dielectric films. An in-situ RF etch can be added to the process to insure good film adhesion and ohmic contact to underlying conductive layers.

Films available for deposition

We offer a wide variety of Sputtered non-precious metals, Dielectric films, and Silicon Precious metals are available for E-Beam evaporation.

Our most popular Sputtered Films include:

Sputtered Films
Thickness range	Varies depending on metal
Thickness tolerance	Target thickness +/-5%
Within wafer uniformity	+/-5% or better
Wafer to wafer uniformity	+/-5% or better
Sides processed	One
Wafer size	50mm, 100mm, 125mm, 150mm, 200mm, 300mm
Wafer thickness	Semi standard
Wafer material	Silicon, Silicon on Insulator, Quartz
Gases	Argon, Nitrogen
Equipment	Sputter deposition tool

Please contact us directly with your Silicon Wafer and Thin Film Deposition requirements. We have a highly experienced engineering, and technical sales team awaiting your call. 541-774-1900 or Sales@RogueValleyMicro.com

We accept Visa, MasterCard, and American Express

Rogue Valley Microdevices is a high quality microelectronics manufacturing facility located in Southern Oregon's Rogue Valley specializing in world-class thin film deposition services. Our silicon wafer processing equipment is capable of volume manufacturing yet flexible enough to accommodate wafer sizes from 50mm to 200mm.

©2006-10 Rogue Valley Microdevices. All rights reserved. All content on this website is the sole intellectual property of Rogue Valley Microdevices, unless otherwise stated, and is intended for this site only. Copying of any part of this site is strictly prohibited. This site and its contents are protected under International Copyright Law. Do not post any of this information on your webpage.