Standard PECVD Processes
Wafer sizes up to 300mm!

Plasma Enhanced Chemical Vapor Deposition (PECVD) allows for thin film deposition at temperatures much lower than those found in LPCVD processing. This is especially useful for wafers that require minimal thermal processing.

The following PECVD Films are available to provide you with more flexibility!

•  Silicon Dioxide
•  Silicon Nitride
•  Low Stress Silicon Nitride
•  Silicon Oxy-Nitride

Check out our Specialty PECVD Processes! 

©2004-5 Rogue Valley Microdevices. All rights reserved. All content on this website is the sole intellectual property of Rogue Valley Microdevices, unless otherwise stated, and is intended for this site only. Copying of any part of this site is strictly prohibited. This site and its contents are protected under International Copyright Law. Do not post any of this information on your webpage.